A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses.