- Patent Title: Electrospun aligned nanofiber adhesives with mechanical interlocks
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Application No.: US16044934Application Date: 2018-07-25
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Publication No.: US11180877B2Publication Date: 2021-11-23
- Inventor: Shing-Chung Josh Wong
- Applicant: Shing-Chung Josh Wong
- Applicant Address: US OH Akron
- Assignee: Shing-Chung Josh Wong
- Current Assignee: Shing-Chung Josh Wong
- Current Assignee Address: US OH Akron
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: D04H1/74
- IPC: D04H1/74 ; C09J5/00

Abstract:
A dry adhesive includes a first plurality of fiber segments mechanically interlocked with a second plurality of fiber segments. A dry adhesive can include a first plurality of fibers mechanically interlocked with a second plurality of fibers or a single plurality of fibers having a first end region mechanically interlocked with a second end region. The fiber segments and fibers can be aligned, electrospun nanofibers. One or more continuous and scalable methods of making aligned fibers are also provided. One or more apparatuses are also provided.
Public/Granted literature
- US20180327947A1 ELECTROSPUN ALIGNED NANOFIBER ADHESIVES WITH MECHANICAL INTERLOCKS Public/Granted day:2018-11-15
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