- Patent Title: Wire shape inspecting apparatus and wire shape inspecting method
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Application No.: US16955785Application Date: 2018-12-20
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Publication No.: US11182921B2Publication Date: 2021-11-23
- Inventor: Shigeru Amemiya
- Applicant: SHINKAWA LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINKAWA LTD.
- Current Assignee: SHINKAWA LTD.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2017-244338 20171220
- International Application: PCT/JP2018/047043 WO 20181220
- International Announcement: WO2019/124508 WO 20190627
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/62 ; G06T7/571

Abstract:
This wire shape inspecting apparatus comprises a camera which captures an image of a wire from above, a light which illuminates the wire from above, and a control unit, wherein the control unit performs: an inspection image acquiring process of acquiring a plurality of inspection images by causing the camera to capture images of the wire a plurality of times while changing a focal distance; and a first shape detecting process of identifying, in each inspection image, a light emitting portion, which is an image part including reflected light comprising light from the light that has been reflected by the wire, and identifying an actual light emitting portion position, which is the actual position of the light emitting portion, on the basis of the position of the light emitting portion in the inspection image and the focal distance when the inspection image was acquired.
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