Invention Grant
- Patent Title: Methods and systems for compressing shape data for electronic designs
-
Application No.: US16793152Application Date: 2020-02-18
-
Publication No.: US11182929B2Publication Date: 2021-11-23
- Inventor: Thang Nguyen , Ajay Baranwal , Michael J. Meyer
- Applicant: Center for Deep Learning in Electronics Manufacturing, Inc.
- Applicant Address: US CA San Jose
- Assignee: Center for Deep Learning in Electronics Manufacturing, Inc.
- Current Assignee: Center for Deep Learning in Electronics Manufacturing, Inc.
- Current Assignee Address: US CA San Jose
- Agency: MLO, a professional corp.
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T9/00

Abstract:
Methods for compressing shape data for a set of electronic designs include inputting a set of shape data, where the shape data represents a set of shapes for a device fabrication process. A convolutional autoencoder is used on the set of shape data, the convolutional autoencoder having a pre-determined set of convolution layers including a kernel size and filter size for each convolution layer. The set of shape data is encoded to compress the set of shape data, using the pre-determined set of convolution layers of the convolutional autoencoder, to create a set of encoded shape data. The set of shape data comprises an SEM image, and the encoded set of shape data identifies a mask defect.
Public/Granted literature
- US20200273210A1 METHODS AND SYSTEMS FOR COMPRESSING SHAPE DATA FOR ELECTRONIC DESIGNS Public/Granted day:2020-08-27
Information query