Invention Grant
- Patent Title: Light irradiation type heat treatment apparatus
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Application No.: US16055293Application Date: 2018-08-06
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Publication No.: US11183403B2Publication Date: 2021-11-23
- Inventor: Masashi Furukawa , Yoshio Ito
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2017-181049 20170921
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
A semiconductor wafer held by a susceptor in a chamber is irradiated with halogen light radiated from a plurality of halogen lamps to be heated. A stainless steel block having an opening in a cylindrical shape is provided between the chamber and the halogen lamps. This reduces a distance from a light emitting portion in a light source region in which the plurality of halogen lamps is arranged, throughout the entire circumference of the opening in a cylindrical shape, so that the amount of reflected light from the inner wall surface of the opening toward the peripheral portion of the semiconductor wafer becomes uniform. This causes a uniform increase in illuminance of the peripheral portion of the semiconductor wafer, where temperature tends to decrease, at the time of light irradiation from the halogen lamps, so that in-plane temperature distribution of the semiconductor wafer can be made uniform.
Public/Granted literature
- US20190088513A1 LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS Public/Granted day:2019-03-21
Information query
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