Invention Grant
- Patent Title: Manufacturing method of heat dissipation component
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Application No.: US16551742Application Date: 2019-08-27
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Publication No.: US11183442B2Publication Date: 2021-11-23
- Inventor: Sz-Shian Wu , Hung-Yi Lee
- Applicant: COMPEQ MANUFACTURING CO., LTD.
- Applicant Address: TW Taoyuan
- Assignee: COMPEQ MANUFACTURING CO., LTD.
- Current Assignee: COMPEQ MANUFACTURING CO., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Priority: TW108123727 20190705
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H05K3/06 ; H05K3/42 ; H05K3/00 ; H01L21/306 ; H05K1/05 ; H05K1/02 ; H01L23/367 ; H01L21/32 ; H01L21/308
Abstract:
The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.
Public/Granted literature
- US20210005530A1 MANUFACTURING METHOD OF HEAT DISSIPATION COMPONENT Public/Granted day:2021-01-07
Information query
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