Invention Grant
- Patent Title: Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other
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Application No.: US16726141Application Date: 2019-12-23
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Publication No.: US11183478B2Publication Date: 2021-11-23
- Inventor: Andrew Huska , Cody Peterson
- Applicant: Rohinni, LLC
- Applicant Address: US ID Coeur d'Alene
- Assignee: Rohinni, LLC
- Current Assignee: Rohinni, LLC
- Current Assignee Address: US ID Coeur d'Alene
- Agency: Lee & Hayes, P.C.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/00

Abstract:
A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.
Information query
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