Invention Grant
- Patent Title: Injection molding electroplating for three-dimensional antennas
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Application No.: US16007967Application Date: 2018-06-13
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Publication No.: US11183881B2Publication Date: 2021-11-23
- Inventor: Joshua Aaron Yankowitz
- Applicant: Yank Technologies, Inc.
- Applicant Address: US NY Brooklyn
- Assignee: Yank Technologies, Inc.
- Current Assignee: Yank Technologies, Inc.
- Current Assignee Address: US NY Brooklyn
- Agency: Perkins Coie LLP
- Main IPC: B29C45/00
- IPC: B29C45/00 ; H01F38/14 ; H01Q1/38 ; H02J5/00 ; H02J50/12 ; H02J50/40 ; H02J7/02 ; H01Q7/00 ; H01F5/00 ; H01F41/04 ; H01Q21/29 ; H02J50/23 ; B29L31/34 ; H01F5/02

Abstract:
An antenna fabrication method includes depositing a conductive material on a surface of a double injection mold that includes a first surface portion comprising a primary material corresponding to a slot of the antenna and a second surface portion comprising an overmold material corresponding to a conductive surface of the antenna such that conductive material does not deposit on the primary material while it deposits on the secondary material, thereby resulting in multiple loops of the conductive material on the surface of the double injection mold, and providing two contact points to the conductive material, the contact points being separated from each other by a gap in the conductive material.
Public/Granted literature
- US20180294677A1 INJECTION MOLDING ELECTROPLATING FOR THREE-DIMENSIONAL ANTENNAS Public/Granted day:2018-10-11
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