Invention Grant
- Patent Title: Low profile integrated fuse module
-
Application No.: US16972748Application Date: 2019-06-06
-
Publication No.: US11189450B2Publication Date: 2021-11-30
- Inventor: Julio Urrea , Gary M. Bold , Hector Perez , Matthew David Yukanin
- Applicant: Littelfuse, Inc.
- Applicant Address: US IL Chicago
- Assignee: Littelfuse, Inc.
- Current Assignee: Littelfuse, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Kacvinsky Daisak Bluni PLLC
- International Application: PCT/US2019/035777 WO 20190606
- International Announcement: WO2019/236835 WO 20191212
- Main IPC: H01H85/50
- IPC: H01H85/50 ; H01H85/02 ; H01H85/055

Abstract:
A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a base portion and a wall portion disposed in a perpendicular relationship, the fuse module further including a fuse plate including an electrically conductive bus bar disposed on a bottom of the base portion, a fusible element electrically connected to the bus bar and disposed adjacent a front of the wall portion, and a fuse terminal electrically connected to the fusible element and disposed on a top of the base portion, the fuse module further including an electrically conductive terminal post extending from the top of the base portion and through the fuse terminal for facilitating connection to an electrical component.
Public/Granted literature
- US20210257176A1 LOW PROFILE INTEGRATED FUSE MODULE Public/Granted day:2021-08-19
Information query