Invention Grant
- Patent Title: Semiconductor device and apparatus of manufacturing the same
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Application No.: US16700801Application Date: 2019-12-02
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Publication No.: US11189633B2Publication Date: 2021-11-30
- Inventor: Taisoo Lim , Kyungwook Park , Keun Lee , Hauk Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0032477 20190321,KR10-2019-0085709 20190716
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L29/423 ; H01L21/67 ; H01L27/11565 ; H01L27/11573 ; H01L21/285 ; H01L21/3213 ; C23C16/56 ; C23C16/455 ; C23C16/06 ; H01L21/28 ; H01L21/02 ; H01L29/66

Abstract:
A semiconductor device includes gate electrodes and interlayer insulating layers that are alternately stacked on a substrate, channel structures spaced apart from each other in a first direction and extending vertically through the gate electrodes and the interlayer insulating layers to the substrate, and a first separation region extending vertically through the gate electrodes and the interlayer insulating layers. Each gate electrode includes a first conductive layer and a second conductive layer, the first conductive layer disposed between the second conductive layer and each of two adjacent interlayer insulating layers. In a first region, between an outermost channel structure and the first separation region, of each gate electrode, the first conductive layer has a decreasing thickness toward the first separation region and the second conductive layer has an increasing thickness toward the first separation region.
Public/Granted literature
- US20200303409A1 SEMICONDUCTOR DEVICE AND APPARATUS OF MANUFACTURING THE SAME Public/Granted day:2020-09-24
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