- Patent Title: VFET standard cell architecture with improved contact and super via
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Application No.: US16711582Application Date: 2019-12-12
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Publication No.: US11189692B2Publication Date: 2021-11-30
- Inventor: Jung Ho Do , Rwik Sengupta
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L29/06 ; H01L29/08 ; H01L29/78

Abstract:
A cell architecture for vertical field-effect transistors (VFETs) is provided. The cell architecture includes: top source/drain (S/D) contact structure having a square shape in a plan view; and horizontal metal patterns formed on the top S/D contact structures and extended in an X-direction to be connected to a vertical pattern through with an output signal of a logic circuit formed by the VFETs. The cell architecture further includes a gate contact structure formed on a gate connection pattern connecting gates of the VFETs, wherein a super via is formed on the gate contact structure to receive an input signal of the logic circuit.
Public/Granted literature
- US20200295134A1 VFET STANDARD CELL ARCHITECTURE WITH IMPROVED CONTACT AND SUPER VIA Public/Granted day:2020-09-17
Information query
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