Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17042401Application Date: 2019-03-14
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Publication No.: US11189722B2Publication Date: 2021-11-30
- Inventor: Yu Saitoh , Takeyoshi Masuda
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: IPUSA, PLLC
- Priority: JPJP2018-077461 20180413
- International Application: PCT/JP2019/010663 WO 20190314
- International Announcement: WO2019/198416 WO 20191017
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/16

Abstract:
A semiconductor device includes a first layer of first conductivity type and including an element region where semiconductor elements are to be formed, an annular second layer of second conductivity type formed to include a surface of the first layer, and surrounding the element region in a plan view, a third layer of second conductivity type formed in the first layer and separated more from the surface than the second layer, and sandwiching a portion of the first layer between the second and third layers, a fourth layer of second conductivity type and electrically connecting the second and third layers, and an electrode electrically connected to the fourth layer inside the second layer in the plan view. effective concentration of a second conductivity type impurity included in the second layer is higher than that of the first layer, and lower than that of the third layer.
Public/Granted literature
- US20210143273A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-05-13
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