A semiconductor device including a semiconductor substrate, a first semiconductor layer provided on a main surface of the semiconductor substrate, a second semiconductor layer selectively provided on a surface of the first semiconductor layer, a plurality of first and second semiconductor regions selectively provided in the second semiconductor layer at a surface thereof, and a plurality of trenches provided in a striped pattern that extends in a first direction. The first semiconductor regions include a plurality of connecting parts and a plurality of non-connecting parts that are alternately arranged in the first direction, each connecting part being continuous in a second direction orthogonal to the first direction, and each non-connecting part being separated into two halves in the second direction by one of the second semiconductor regions, each half including a plurality of regions having different resistance values, disposed in a descending order or an ascending order of the resistance values along the first direction.