Invention Grant
- Patent Title: Photoelectric sensor and manufacturing method thereof
-
Application No.: US16819833Application Date: 2020-03-16
-
Publication No.: US11189740B2Publication Date: 2021-11-30
- Inventor: Jianhua Du , Chao Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: The Webb Law Firm
- Priority: CN201911141965.1 20191120
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/032 ; H01L31/0216 ; H01L31/0272 ; H01L31/20

Abstract:
The embodiment of the application discloses a photoelectric sensor and a manufacturing method thereof, wherein the photoelectric sensor comprises: a light absorbing layer for absorbing incident light to generate a photocurrent, the light absorption layer comprises a first absorption layer and a second absorption layer stacked in the direction of incident light, the first absorption layer being an intrinsic semiconductor layer of the photoelectric sensor, the second absorption layer being made of a material having a higher photoelectric conversion efficiency than the first absorption layer, and the second absorption layer has a stripe structure arranged at intervals.
Public/Granted literature
- US20210151615A1 Photoelectric Sensor and Manufacturing Method Thereof Public/Granted day:2021-05-20
Information query
IPC分类: