Invention Grant
- Patent Title: Composite substrate for preventing bonding failure between substrates
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Application No.: US16015944Application Date: 2018-06-22
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Publication No.: US11189775B2Publication Date: 2021-11-30
- Inventor: Keita Hirai
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: Merchant & Gould P.C.
- Priority: JPJP2017-192151 20170929
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01L41/047 ; B41J2/14 ; H01L41/09 ; H01L41/187

Abstract:
A composite substrate has: a first substrate having a first bump protruding therefrom; and a second substrate having a first surface in contact with the first bump, and a second surface opposite to the first surface, the second surface having a second bump protruding therefrom, the second substrate being laminated on the first substrate in a thickness direction perpendicular to the first surface. The first bump and the second bump are partially overlapped with each other as viewed in the thickness direction. The second bump has a rigidity which is lower than a rigidity of the first bump.
Public/Granted literature
- US20190103546A1 COMPOSITE SUBSTRATE FOR PREVENTING BONDING FAILURE BETWEEN SUBSTRATES Public/Granted day:2019-04-04
Information query
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