Invention Grant
- Patent Title: Socket soldering contact and contact module for a printed circuit board
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Application No.: US16762636Application Date: 2018-11-08
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Publication No.: US11189947B2Publication Date: 2021-11-30
- Inventor: Andreas Schrader , Ingo Werner
- Applicant: PHOENIX CONTACT GMBH & CO. KG
- Applicant Address: DE Blomberg
- Assignee: PHOENIX CONTACT GMBH & CO. KG
- Current Assignee: PHOENIX CONTACT GMBH & CO. KG
- Current Assignee Address: DE Blomberg
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Priority: BE2017/5814 20171110
- International Application: PCT/EP2018/080567 WO 20181108
- International Announcement: WO2019/092080 WO 20190516
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/11 ; H01R12/70 ; H01R12/71 ; H01R12/72 ; H01R13/17 ; H01R13/436

Abstract:
A solder socket contact for a printed circuit board, comprising a first contact element and a second contact element, wherein the first contact element has at least one soldering pin which is designed to be soldered to the printed circuit board, the first contact element has a contact region for contacting a plug contact, the second contact element has at least one soldering pin which is designed to be soldered to the printed circuit board, the second contact element has a contact region for contacting the plug contact, and the first contact element and the second contact element form an individual pole for contacting the plug contact.
Public/Granted literature
- US20200280146A1 SOCKET SOLDERING CONTACT AND CONTACT MODULE FOR A PRINTED CIRCUIT BOARD Public/Granted day:2020-09-03
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