Invention Grant
- Patent Title: Apparatus for electrically interconnecting two laminated multi-phase busbars
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Application No.: US17223033Application Date: 2021-04-06
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Publication No.: US11189998B2Publication Date: 2021-11-30
- Inventor: Maciej Mruczek
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: H02G5/00
- IPC: H02G5/00 ; H02B13/00

Abstract:
An apparatus for electrically connecting busbars includes: a first laminated multi-phase busbar to be connected to a second laminated multi-phase busbar, each of the first and second laminated multi-phase busbars including a plurality of conducting layers and insulating layers which are arranged between the conducting layers, the conducting layers of the first laminated multi-phase busbar projecting from the insulating layers thereof, forming a first lateral connecting portion with first electrical contact surfaces, and the conducting layers of the second laminated multi-phase busbar projecting from the insulating layers thereof, forming a second lateral connecting portion with second electrical contact surfaces; and a bridging element that includes a plurality of laminated insulating layers and conducting layers having electrical contact surfaces which contact associated electrical contact surfaces of the first and second lateral connecting portions of the first and second busbar.
Public/Granted literature
- US20210226434A1 APPARATUS FOR ELECTRICALLY INTERCONNECTING TWO LAMINATED MULTI-PHASE BUSBARS Public/Granted day:2021-07-22
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