Invention Grant
- Patent Title: Power wiring apparatus
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Application No.: US16977811Application Date: 2019-03-07
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Publication No.: US11190130B2Publication Date: 2021-11-30
- Inventor: Midori Yamaai , Masayoshi Yoshida
- Applicant: ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenja IP Law PC
- Priority: JPJP2018-055219 20180322
- International Application: PCT/JP2019/009109 WO 20190307
- International Announcement: WO2019/181536 WO 20190926
- Main IPC: H02S40/36
- IPC: H02S40/36 ; H02S10/40 ; H02S30/20 ; H02S40/34 ; H02J7/35

Abstract:
The present disclosure aims to provide a power wiring apparatus that has improved portability and convenience. A power wiring apparatus of the present disclosure includes a plate-shaped wiring member, which includes a plurality of first connectors and is configured to conductively connect the plurality of first connectors to each other, and a plate-shaped external circuit element mounted on the wiring member and including a second connector mechanically and electrically attachable to and detachable from any first connector among the plurality of first connectors. The insertion and removal direction of the second connector with respect to the first connector is substantially parallel to the surface direction of the external circuit element. The external circuit element includes an energy harvesting element as a circuit element capable of outputting, from the second connector, power generated by energy harvesting.
Information query