Invention Grant
- Patent Title: Package and method for manufacturing same
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Application No.: US16345473Application Date: 2017-08-24
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Publication No.: US11192691B2Publication Date: 2021-12-07
- Inventor: Masayuki Tamura , Takuro Yoneda
- Applicant: Teijin Limited
- Applicant Address: JP Osaka
- Assignee: Teijin Limited
- Current Assignee: Teijin Limited
- Current Assignee Address: JP Osaka
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2016-211749 20161028
- International Application: PCT/JP2017/030376 WO 20170824
- International Announcement: WO2018/079039 WO 20180503
- Main IPC: B65D25/10
- IPC: B65D25/10 ; B65D81/05 ; B65D85/62 ; B65D19/44 ; B65D19/18

Abstract:
Provided are: a package that is capable of transporting a composite material without generating fluff by suppressing shedding of carbon fibers from the composite material while holding the composite material at a fixed position during transportation; and a method for manufacturing the package. This package is prepared by stacking a composite material in the form of a plurality of plates on a mounting stand having a plurality of fitting holes, wherein: the composite material includes carbon fibers and a thermoplastic resin; the composite material is held by a plurality of holding members detachably attached to the fitting holes; of the contact surfaces of the composite material and the holding members, one of the contact surfaces of either the composite material or the holding members is curved, and the other contact surface is flat or curved.
Public/Granted literature
- US20190276187A1 Package and Method for Manufacturing Same Public/Granted day:2019-09-12
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