Invention Grant
- Patent Title: MEMS sensor package systems and methods
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Application No.: US15864787Application Date: 2018-01-08
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Publication No.: US11192777B2Publication Date: 2021-12-07
- Inventor: Bernhard Winkler , Rainer Leuschner , Horst Theuss
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; G01L9/00 ; G01L15/00 ; G01L19/14 ; H01L29/84 ; H01L23/31 ; H01L21/56

Abstract:
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
Public/Granted literature
- US20180127267A1 MEMS SENSOR PACKAGE SYSTEMS AND METHODS Public/Granted day:2018-05-10
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