Invention Grant
- Patent Title: Enhanced nickel plating process
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Application No.: US16676344Application Date: 2019-11-06
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Publication No.: US11192822B2Publication Date: 2021-12-07
- Inventor: Mohd Aizat Abdul Wadi , Shian Ming Liew , Shan Lih Lim
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Loza & Loza, LLP
- Agent Gabriel Fitch
- Main IPC: C03C17/36
- IPC: C03C17/36 ; C03C17/38 ; C23C18/18 ; C23C18/32 ; C23C18/36 ; G11B5/73 ; C23C18/16
Abstract:
A method for plating nickel onto a glass surface of a substrate by sequentially contacting the surface with a solution having an oxidizing agent, a solution containing a silane compound, a Pd/Sn solution, and a nickel ion-containing solution, thereby accomplishing an electroless nickel plating process.
Public/Granted literature
- US20200148589A1 ENHANCED NICKEL PLATING PROCESS Public/Granted day:2020-05-14
Information query
