Invention Grant
- Patent Title: Polymer material, composition, and method of manufacturing semiconductor device
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Application No.: US16562786Application Date: 2019-09-06
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Publication No.: US11192972B2Publication Date: 2021-12-07
- Inventor: Koji Asakawa , Norikatsu Sasao , Shinobu Sugimura
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner L.L.P.
- Priority: JPJP2019-044104 20190311
- Main IPC: C08L33/10
- IPC: C08L33/10 ; C08F220/14 ; G03F7/038 ; G03F7/039 ; H01L21/027 ; H01L21/311 ; H01L27/11582 ; G03F7/16 ; G03F7/20 ; H01L27/11556

Abstract:
According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.
Public/Granted literature
- US20200291156A1 POLYMER MATERIAL, COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2020-09-17
Information query
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