Invention Grant
- Patent Title: RF tag
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Application No.: US16647388Application Date: 2018-08-10
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Publication No.: US11195076B2Publication Date: 2021-12-07
- Inventor: Shinya Akamatsu
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JPJP2017-190694 20170929
- International Application: PCT/JP2018/030079 WO 20180810
- International Announcement: WO2019/064964 WO 20190404
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01Q1/22 ; H01Q7/00

Abstract:
The present invention improves the communication characteristics of an inlay using an auxiliary antenna, while protecting the inlay from physical and mechanical external forces, shocks or the like, without being subjected to the constraints of a dipole antenna. To that end, the present invention has a configuration, including: an inlay having an IC chip and only a loop circuit antenna, on which the IC chip is mounted, and not including another antenna; a casing for accommodating the inlay therein; and a planar top cover covering one surface side of the casing. The top cover is formed of a prescribed metallic material and includes a cutout opening at least on one side. The inlay is disposed in the casing so as to be positioned inside the cutout. The top cover functions as an antenna of the inlay by being electrically connected to the inlay.
Public/Granted literature
- US20210019587A1 RF TAG Public/Granted day:2021-01-21
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