A multilayer electronic component includes a body including a capacitance forming portion including dielectric layers and first and second internal electrodes with respective dielectric layers interposed therebetween and an upper cover portion and a lower cover portion, respectively disposed above and below the capacitance forming portion, and first and second external electrodes disposed on the body and respectively connected to the first and second internal electrodes. At least one of the upper cover portion or the lower cover portion includes a dummy electrode layer including a dummy pattern having a mesh shape. The dummy pattern includes a first dummy pattern, connected to the first external electrode, and a second dummy pattern spaced apart from the first dummy pattern and connected to the second external electrode.