Invention Grant
- Patent Title: Multilayer ceramic electronic component, and mounting structure for multilayer ceramic electronic component
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Application No.: US16590482Application Date: 2019-10-02
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Publication No.: US11195660B2Publication Date: 2021-12-07
- Inventor: Yosuke Terashita , Katsumi Oka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2018-191903 20181010
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/12 ; H01G4/232

Abstract:
A multilayer ceramic capacitor includes a laminate and an outer electrode. The laminate includes a plurality of laminated ceramic layers and a plurality of internal electrode layers. The internal electrode layers are respectively laminated on the ceramic layers. The outer electrode is provided on each end surface of the laminate. Each outer electrode includes a metal layer. The metal layer includes at least a Pd layer, an Ni layer, and an Sn layer laminated from a portion adjacent to or in a vicinity of the laminate in order of the Pd layer, the Ni layer, and the Sn layer. The metal layer is located at an outermost surface of the outer electrode. A thickness of the Ni layer is greater than or equal to about 0.4.
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