Invention Grant
- Patent Title: Temporary protective film for semiconductor sealing molding
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Application No.: US16612106Application Date: 2018-01-25
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Publication No.: US11195728B2Publication Date: 2021-12-07
- Inventor: Naoki Tomori , Tomohiro Nagoya
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2017-094157 20170510
- International Application: PCT/JP2018/002313 WO 20180125
- International Announcement: WO2018/207408 WO 20181115
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; H01L23/498 ; H01L23/00
Abstract:
Disclosed is a temporary protective film for semiconductor sealing molding 10 including a support film 1; and an adhesive layer 2 provided on the support film 1 and containing an acrylic rubber. A solid shear modulus at 200° C. of the temporary protective film for semiconductor sealing molding 10 may be 5.0 MPa or higher.
Information query
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