Invention Grant
- Patent Title: Proximity contact cover ring for plasma dicing
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Application No.: US14491856Application Date: 2014-09-19
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Publication No.: US11195756B2Publication Date: 2021-12-07
- Inventor: James M. Holden , Alexander N. Lerner , Ajay Kumar , Aparna Iyer , Alan Hiroshi Ouye
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/78 ; H01L21/67 ; H01L21/683 ; H01L21/3065 ; H01L21/308
Abstract:
Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.
Public/Granted literature
- US20160086852A1 PROXIMITY CONTACT COVER RING FOR PLASMA DICING Public/Granted day:2016-03-24
Information query
