Invention Grant
- Patent Title: Power module substrate and power module
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Application No.: US16627099Application Date: 2018-05-22
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Publication No.: US11195776B2Publication Date: 2021-12-07
- Inventor: Yoshitada Konishi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2017-126375 20170628
- International Application: PCT/JP2018/019679 WO 20180522
- International Announcement: WO2019/003725 WO 20190103
- Main IPC: H01L23/373
- IPC: H01L23/373

Abstract:
A power module substrate includes an insulating substrate and a metal plate. The metal plate is joined to the insulating substrate with a brazing material in between. As to surface roughness of a lateral surface of the metal plate in a thickness direction, the surface roughness of at least a corner part farthest from a center of the metal plate in plan view is larger than the surface roughness of plane parts sandwiching the corner part.
Information query
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