Invention Grant
- Patent Title: High frequency waveguide structure
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Application No.: US16348698Application Date: 2016-12-29
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Publication No.: US11195806B2Publication Date: 2021-12-07
- Inventor: Vijay K. Nair , Digvijay Ashokkumar Raorane
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/069248 WO 20161229
- International Announcement: WO2018/125150 WO 20180705
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/48 ; H01L23/538 ; H01P3/12 ; H01P11/00 ; H04B7/00 ; H01L25/065
Abstract:
An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.
Public/Granted literature
- US20190267337A1 HIGH FREQUENCY WAVEGUIDE STRUCTURE Public/Granted day:2019-08-29
Information query
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