Invention Grant
- Patent Title: Semiconductor device having deep wells
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Application No.: US16866506Application Date: 2020-05-04
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Publication No.: US11195834B2Publication Date: 2021-12-07
- Inventor: Meng-Han Lin , Chih-Ren Hsieh , Chen-Chin Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L27/092 ; H01L27/11546 ; H01L27/11526 ; H01L27/11575 ; H01L29/10 ; H01L21/266 ; H01L21/761 ; H01L21/762 ; H01L21/8234 ; H01L21/8238

Abstract:
A semiconductor device includes first and second voltage device regions and a deep well common to the first and second voltage device regions. An operation voltage of electronic devices in the second voltage device region is higher than that of electronic devices in the first voltage device region. The deep well has a first conductivity type. The first voltage device region includes a first well having the second conductivity type and a second well having the first conductivity type. The second voltage region includes a third well having a second conductivity type and a fourth well having the first conductivity type. A second deep well having the second conductivity type is formed below the fourth well. The first, second and third wells are in contact with the first deep well, and the fourth well is separated by the second deep well from the first deep well.
Public/Granted literature
- US20200266196A1 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-08-20
Information query
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