Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16801278Application Date: 2020-02-26
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Publication No.: US11195856B2Publication Date: 2021-12-07
- Inventor: Yoon Hwan Son , Ji Sung Cheon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0070657 20190614
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11524 ; H01L27/11573 ; H01L27/11529 ; H01L27/1157 ; H01L27/11556

Abstract:
A semiconductor device includes a first substrate in which a first region and a second region are defined, a first stack structure with first gate electrodes displaced and stacked sequentially on the first substrate, a second stack structure with second gate electrodes displaced and stacked sequentially on the first stack structure, a junction layer disposed between the first stack structure and the second stack structure, a first interlayer insulating layer disposed on a side surface of the first stack structure, a second interlayer insulating layer covering the second stack structure, a first channel hole that penetrates through structure(s) and/or layer(s) and a second channel hole that penetrates through structure(s) and/or layer(s). A height of the second portion of the first channel hole in a second direction orthogonal to the first direction is less than a height of the second portion of the second channel hole in the second direction.
Information query
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