Invention Grant
- Patent Title: Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate
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Application No.: US16996306Application Date: 2020-08-18
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Publication No.: US11195971B2Publication Date: 2021-12-07
- Inventor: Toshihiko Watanabe
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2016-050473 20160315
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/48 ; H05K7/00 ; H01L33/20 ; H01L33/62 ; H05K3/18 ; H05K3/42 ; H05K1/02 ; H05K1/18 ; H05K3/14 ; H05K1/11 ; H01L27/12 ; H01L27/15
Abstract:
A glass wiring substrate includes a glass substrate, a first wiring portion formed on a first surface of the glass substrate, a second wiring portion formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.
Public/Granted literature
Information query
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