Invention Grant
- Patent Title: Encapsulation structure, production method thereof, glue-spreading device, and encapsulation glue
-
Application No.: US15989144Application Date: 2018-05-24
-
Publication No.: US11196026B2Publication Date: 2021-12-07
- Inventor: Chengyuan Luo
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201710983868.1 20171020
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; B32B27/20 ; B32B27/30 ; C09J11/04 ; C09J133/02 ; C08K3/22 ; C08K3/08 ; C09J133/04
Abstract:
Provided are an encapsulation structure, a production method thereof, a glue-spreading device, and an encapsulation glue. The encapsulation structure has an encapsulation glue layer, wherein the encapsulation glue layer has an adhesive layer formed from an adhesive glue and a desiccant composition core formed from a colloidal desiccant composition, wherein the adhesive layer fully envelops the desiccant composition core, wherein the colloidal desiccant composition has a colloidal desiccant-dispersing medium and a desiccant dispersed in the colloidal desiccant-dispersing medium.
Public/Granted literature
- US20190123302A1 ENCAPSULATION STRUCTURE, PRODUCTION METHOD THEREOF, GLUE-SPREADING DEVICE, AND ENCAPSULATION GLUE Public/Granted day:2019-04-25
Information query
IPC分类:
