Invention Grant
- Patent Title: Radio frequency circuit board interconnect assembly
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Application No.: US16897149Application Date: 2020-06-09
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Publication No.: US11196182B1Publication Date: 2021-12-07
- Inventor: Brian L. Taylor , David M. Dyer , Steven Sprinkle , Paul E. Schlittler
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: H01Q21/28
- IPC: H01Q21/28 ; H01Q23/00 ; H01Q9/16

Abstract:
A radio frequency (RF) circuit connection assembly comprises a RF circuit board and a RF connector. The RF circuit board has a first side and a second side opposite the first side. A RF circuit is located on the first side and an aperture extends through the RF circuit board from the first side to the second side. The RF connector comprises a barrel having a socket configured to receive a RF bullet, a flange having a mounting surface, and a RF connector pin extending laterally from the barrel. The barrel of the RF connector extends through the aperture of the RF circuit board such that the mounting surface of the flange is seated against the first side of the RF circuit board, and the RF connector pin is electrically coupled to the RF circuit on the first side of the RF circuit board.
Public/Granted literature
- US20210384647A1 Radio Frequency Circuit Board Interconnect Assembly Public/Granted day:2021-12-09
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