Invention Grant
- Patent Title: Connection structure, forming method of connection structure and cable of connection structure
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Application No.: US16907353Application Date: 2020-06-22
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Publication No.: US11196205B2Publication Date: 2021-12-07
- Inventor: Kentaro Toda , Yoshihiro Sugii
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2019-131187 20190716
- Main IPC: H01R13/426
- IPC: H01R13/426 ; H01R43/20 ; H01R13/506 ; H01R13/516

Abstract:
A connection structure comprises a cable and a connection object. The cable includes two wires and an insulation body which covers and binds the two wires. The insulation body includes two coverings which cover the wires, respectively. The connection object comprises a base portion and a pressing member. The base portion has a catch portion and a cable-holding portion. The cable has a held section and a pressed section. The held section is held by the cable-holding portion. The pressed section is sandwiched and pressed between the pressing member and the catch portion in an upper-lower direction (Z-direction). The insulation body of the pressed section includes a coupling strip. The coupling strip couples the two coverings to each other in a lateral direction (Y-direction).
Public/Granted literature
- US20210021073A1 CONNECTION STRUCTURE, FORMING METHOD OF CONNECTION STRUCTURE AND CABLE OF CONNECTION STRUCTURE Public/Granted day:2021-01-21
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