Invention Grant
- Patent Title: Damping arrangement for power electronics applications
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Application No.: US16971640Application Date: 2019-02-05
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Publication No.: US11197364B2Publication Date: 2021-12-07
- Inventor: Ivonne Trenz
- Applicant: ZF Friedrichshafen AG
- Applicant Address: DE Friedrichshafen
- Assignee: ZF Friedrichshafen AG
- Current Assignee: ZF Friedrichshafen AG
- Current Assignee Address: DE Friedrichshafen
- Agency: Crowell & Moring LLP
- Priority: DE102018202659.9 20180222
- International Application: PCT/EP2019/052711 WO 20190205
- International Announcement: WO2019/162078 WO 20190829
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; B60L15/00 ; G01R19/00 ; H05K1/18

Abstract:
What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.
Public/Granted literature
- US20200383201A1 DAMPING ARRANGEMENT FOR POWER ELECTRONICS APPLICATIONS Public/Granted day:2020-12-03
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