A printed circuit board includes: multiple electrically insulating laminate sheets laminated together in a stack; a first electrically conductive layer formed from a superconductor material arranged on a first exterior surface of the stack, the first electrically conductive layer including a signal line and a ground plane; a second electrically conductive layer formed from a superconductor material arranged on a second exterior surface of the stack, the second exterior surface opposing the first exterior surface; a third conductive trace between a first electrically insulating laminate sheet of the stack and a directly adjacent second electrically insulating laminate sheet of the stack; a first via extending through from the signal line through the stack to the third conductive trace, in which the signal line is electrically connected to the third conductive trace through the via.