Invention Grant
- Patent Title: Inductor built-in substrate
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Application No.: US17106321Application Date: 2020-11-30
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Publication No.: US11197373B2Publication Date: 2021-12-07
- Inventor: Satoru Kawai
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Gifu
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Gifu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-227174 20191217
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H05K3/46

Abstract:
An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening formed in the core substrate such that the magnetic resin has second through holes formed therein, a first through-hole conductor formed in the first through hole of the core substrate and including a metal film formed in the first through hole of the core substrate, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin, respectively.
Public/Granted literature
- US20210185818A1 INDUCTOR BUILT-IN SUBSTRATE Public/Granted day:2021-06-17
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