Invention Grant
- Patent Title: Modular electronic housing for housing electronic components and a method for producing the same
-
Application No.: US16328285Application Date: 2017-08-24
-
Publication No.: US11197381B2Publication Date: 2021-12-07
- Inventor: Eduard Unger , Helmut Eusterholz , Carsten Paulini
- Applicant: PHOENIX CONTACT GMBH & CO. KG
- Applicant Address: DE Blomberg
- Assignee: PHOENIX CONTACT GMBH & CO. KG
- Current Assignee: PHOENIX CONTACT GMBH & CO. KG
- Current Assignee Address: DE Blomberg
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: LU93185 20160829
- International Application: PCT/EP2017/071374 WO 20170824
- International Announcement: WO2018/041725 WO 20180308
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14
Abstract:
A modular electronic housing includes: a housing series body whose receiving chamber houses an electronic component; and a maintaining device for maintaining the electronic component on the housing series body, the maintaining device having at least one holding body for the electronic component, which holding body is materially bonded to the housing series body in a bonding position.
Public/Granted literature
- US20200245474A1 MODULAR ELECTRONIC HOUSING FOR HOUSING ELECTRONIC COMPONENTS AND A METHOD FOR PRODUCING THE SAME Public/Granted day:2020-07-30
Information query
