Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).