Invention Grant
- Patent Title: Multilayer capacitor and manufacturing method for the same
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Application No.: US16537845Application Date: 2019-08-12
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Publication No.: US11201010B2Publication Date: 2021-12-14
- Inventor: Yeang Jun Kim , Gam Woo Kim , Jae Won Kim , Jin Kyung Joo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0007517 20190121
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/12 ; H01G4/228 ; H01G4/30

Abstract:
A multilayer capacitor includes a capacitor body including first and sixth surfaces; including an active region including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and cover regions disposed on an upper surface and a lower surface of the active region; and having one end of each of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body. Each of the cover regions has a plurality of holes.
Public/Granted literature
- US20200234880A1 MULTILAYER CAPACITOR AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2020-07-23
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