Invention Grant
- Patent Title: Optoelectronic assembly and method for producing an optoelectronic assembly
-
Application No.: US15512075Application Date: 2015-09-16
-
Publication No.: US11201310B2Publication Date: 2021-12-14
- Inventor: Philipp Schwamb , Erwin Lang , Arne Fleissner
- Applicant: PICTIVA DISPLAYS INTERNATIONAL LIMITED
- Applicant Address: IE Dublin
- Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITED
- Current Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITED
- Current Assignee Address: IE Dublin
- Agency: Botos Churchill IP Law LLP
- Priority: DE102014218667.6 20140917
- International Application: PCT/EP2015/071253 WO 20150916
- International Announcement: WO2016/042042 WO 20160324
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/30 ; H01L27/32 ; H01L51/44

Abstract:
An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.
Public/Granted literature
- US20170317310A1 OPTOELECTRONIC ASSEMBLY AND METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY Public/Granted day:2017-11-02
Information query
IPC分类: