Invention Grant
- Patent Title: Speaker module
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Application No.: US16080856Application Date: 2016-05-18
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Publication No.: US11202134B2Publication Date: 2021-12-14
- Inventor: Dan Han , Xinxiang Huo , Yun Yang
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN Weifang
- Agency: Saliwankchik, Lloyd & Eisenschenk
- Priority: CN201610112352.5 20160229
- International Application: PCT/CN2016/082422 WO 20160518
- International Announcement: WO2017/148008 WO 20170908
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/02 ; H04R9/02 ; H04R9/06 ; H04R1/28

Abstract:
The present invention discloses a speaker module, comprising a housing and a speaker unit located in an inner cavity of the housing and dividing the inner cavity into a front acoustic cavity and a rear acoustic cavity separated from each other, wherein the housing is additionally provided with a pressure relief device configured to communicate the rear acoustic cavity with an external environment and implement an acoustic seal, the pressure relief device comprises a pressure relief hole extending through a thickness direction of the housing and provided with a gland on one side close to the rear acoustic cavity, and a pressure relief groove is disposed at a surface of the gland close to the pressure relief hole, one end of the pressure relief groove is connected with the pressure relief hole, the other end of the pressure relief groove is led out of an end of the gland, and the pressure relief groove and the pressure relief hole together make up a pressure relief passage of the rear acoustic cavity. The pressure relief grooves of the pressure relief devices of the speaker modules are arranged on the gland, which makes processing easier and can effectively improve the yield of the speaker module.
Public/Granted literature
- US20190098385A1 SPEAKER MODULE Public/Granted day:2019-03-28
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