Invention Grant
- Patent Title: MEMS capacitor microphone
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Application No.: US16760540Application Date: 2018-09-06
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Publication No.: US11202156B2Publication Date: 2021-12-14
- Inventor: Quanbo Zou , Yongwei Dong
- Applicant: Goertek, Inc.
- Applicant Address: CN Weifang
- Assignee: Goertek, Inc.
- Current Assignee: Goertek, Inc.
- Current Assignee Address: CN Weifang
- Agency: Baker Botts, LLP
- Priority: CN201810660834.3 20180625
- International Application: PCT/CN2018/104440 WO 20180906
- International Announcement: WO2020/000649 WO 20200102
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R1/06 ; H04R3/00 ; H04R7/06 ; H04R7/18 ; B81B3/00

Abstract:
An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/μm.
Public/Granted literature
- US20210227335A1 MEMS CAPACITOR MICROPHONE Public/Granted day:2021-07-22
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