Invention Grant
- Patent Title: Electronic device comprising flexible printed circuit board having arranged thereon plurality of ground wiring surrounding signal wiring
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Application No.: US17258631Application Date: 2019-06-05
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Publication No.: US11202364B2Publication Date: 2021-12-14
- Inventor: Eunseok Hong , Jungje Bang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR10-2018-0079593 20180709
- International Application: PCT/KR2019/006794 WO 20190605
- International Announcement: WO2020/013449 WO 20200116
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
An electronic device according to various embodiments comprises: a circuit element; a printed circuit board comprising a first connection pad connected to the ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a flexible printed circuit board (FPCB) comprising a coupling part connected to the printed circuit board, and a connection part extending from the coupling part, wherein the FPCB comprises first ground wiring connected to the first connection pad and extending from the coupling part to the connection part in an assigned direction, second ground wiring connected to the second connection pad and extending from the coupling part to the connection part in the assigned direction, signal wiring connected to the third connection pad and extending from the coupling part to the connection part in the assigned direction, while being arranged between the first ground wiring and the second ground wiring, and third ground wiring arranged in an opposite direction to the assigned direction so as to be connected, in the coupling part, to the first ground wiring and the second ground wiring and surround the signal wiring. Other various embodiments are possible.
Public/Granted literature
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