A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.