Invention Grant
- Patent Title: Methods of manufacturing low-temperature polysilicon thin film and transistor
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Application No.: US16761111Application Date: 2017-11-14
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Publication No.: US11205712B2Publication Date: 2021-12-21
- Inventor: Huailiang He
- Applicant: HKC Corporation Limited
- Applicant Address: CN Guangdong
- Assignee: HKC Corporation Limited
- Current Assignee: HKC Corporation Limited
- Current Assignee Address: CN Guangdong
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201711070385.9 20171103
- International Application: PCT/CN2017/110804 WO 20171114
- International Announcement: WO2019/085009 WO 20190509
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/324 ; H01L29/786

Abstract:
A method of manufacturing a low temperature polysilicon thin film includes: forming a buffer layer on a substrate; forming a first silicon layer on the buffer layer; forming a second silicon layer on the first silicon layer, and forming a substrate impurity barrier interface between the first silicon layer and the second silicon layer, wherein the second silicon layer is thicker than the first silicon layer; and annealing the first silicon layer and the second silicon layer to form a polysilicon layer.
Public/Granted literature
- US20200295154A1 METHODS OF MANUFACTURING LOW-TEMPERATURE POLYSILICON THIN FILM AND TRANSISTOR Public/Granted day:2020-09-17
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