Invention Grant
- Patent Title: Insulated-gate semiconductor device
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Application No.: US16777137Application Date: 2020-01-30
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Publication No.: US11205719B2Publication Date: 2021-12-21
- Inventor: Hiroyuki Miyashita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2019-55519 20190322
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L29/10

Abstract:
An insulated-gate semiconductor device includes: a carrier transport layer of a first conductivity-type made of a semiconductor material having a wider band gap than silicon; a lower buried region of a second conductivity-type buried in an upper portion of the carrier transport layer; a plurality of upper buried regions of the second conductivity-type dispersedly deposited on the lower buried region; an injection control region of the second conductivity-type deposited on the upper buried regions; and an insulated gate structure controlling a surface potential of the injection control region adjacent to a side wall of a trench, wherein the trench has a stripe-like shape, the lower buried region includes a first stripe provided separately from the trench, and the respective upper buried regions are provided at intervals on the first stripe.
Public/Granted literature
- US20200303540A1 INSULATED-GATE SEMICONDUCTOR DEVICE Public/Granted day:2020-09-24
Information query
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