Invention Grant
- Patent Title: Fluid heat dissipation device
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Application No.: US16896222Application Date: 2020-06-09
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Publication No.: US11206746B1Publication Date: 2021-12-21
- Inventor: Chia-Hsing Liu
- Applicant: Chia-Hsing Liu
- Applicant Address: TW Taipei
- Assignee: Chia-Hsing Liu
- Current Assignee: Chia-Hsing Liu
- Current Assignee Address: TW Taipei
- Agency: Li & Cai Intellectual Property Office
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.
Public/Granted literature
- US20210385972A1 FLUID HEAT DISSIPATION DEVICE Public/Granted day:2021-12-09
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