Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16136944Application Date: 2018-09-20
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Publication No.: US11211188B2Publication Date: 2021-12-28
- Inventor: Yusuke Nagai , Takashi Suzuki , Hidekazu Sato , Takashi Endo , Kouichi Kakuda , Kunihiko Kawasaki , Shinichi Kondo , Yuya Ishima , Shinichi Sato , Masaki Takahashi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-183980 20170925
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01F27/34 ; H01F41/04 ; H01F27/29

Abstract:
In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.
Public/Granted literature
- US20190096561A1 MULTILAYER COIL COMPONENT Public/Granted day:2019-03-28
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |